PCB name： MTI-1PSEM-94-1-20240118
PCB size (single module) ：4.356x4.469inch
Layers：2
Board Thickness：1.6mm Green
Copper Foil Thickness：35um
Material： FR‐4 KB6160, 1oz, Cu, (Finish)

The information in this document constitutes intellectual property rights of MicroTech Industries (Pvt.) Ltd. It shall be understood that the contents of the document are confidential and only to be used within the scope of the said project. This document, or portions thereof, should not be utilized or distributed in any way to any third party without prior written approval of MicroTech Industries.

Features
Package size: 3.2x1.5 mm,t = 0.9 mm Max.
Nominal frequency range:32.768 kHz
Frequency tolerance: ± 5 x10-6 (+25 ℃ ±5°C)
Operating temperature: -40℃ to +85℃
(-40°C to +105 °C) Please contact Epson
ESR: 70 kΩ Typ.

The information in this document constitutes intellectual property rights of MicroTech Industries (Pvt.) Ltd. It shall be understood that the contents of the document are confidential and only to be used within the scope of the said project. This document, or portions thereof, should not be utilized or distributed in any way to any third party without prior written approval of MicroTech Industries.

PCB name： MTI-3PFF-47X-5-20231226
PCB size (single module) ：5.8x3.25inch
Layers：2
Board Thickness：1.6mm Green
Copper Foil Thickness：35um
Material： FR‐4 KB6160, 1oz, Cu, (Finish)

PCB name： MTI-1PEM-9X-4-20240418
PCB size (single module) ：3.025x2.312 inch
Layers：2
Board Thickness：1.6mm Green
Copper Foil Thickness：35um
Material： FR‐4 KB6160, 1oz, Cu, (Finish)

Model: SCCDPR2R7106QRH125020EP-N

RATED CAPACITANCE: 10F
RETED VOLTAGE:2.7V
CAPACITANCE TOLERANCE:-10%~+30%

Model: SE-5R5-D105VYC3G
Capability: 1F
Permitting Capacitance Error:0~+30%
Rated Voltage (25℃) U0:5.5V
Category Temperature Range:-25~+70℃

The information in this document constitutes intellectual property rights of MicroTech Industries (Pvt.) Ltd.  It shall be understood that the contents of the document are confidential and only to be used within the scope of the said project. This document, or portions thereof, should not be utilized or distributed in any way to any third party without prior written approval of MicroTech Industries.